2 papers
physics.app-ph2020
The Effect of Pitch Distance on the Statistics and Morphology of Through-Silicon Via Extrusion
Golareh Jalilvand, Omar Ahmed, Nicolas Dube +1
In this work, we investigated the effect of pitch distance on the statistical variation and morphology of extrusion in Cu TSVs and the underlying mechanisms. Extrusion statistics w…
cs.CV2020
TSV Extrusion Morphology Classification Using Deep Convolutional Neural Networks
Brendan Reidy, Golareh Jalilvand, Tengfei Jiang +1
In this paper, we utilize deep convolutional neural networks (CNNs) to classify the morphology of through-silicon via (TSV) extrusion in three dimensional (3D) integrated circuits…