2 papers
quant-ph2025
Performance Characterization of a Multi-Module Quantum Processor with Static Inter-Chip Couplers
Graham J. Norris, Kieran Dalton, Dante Colao Zanuz +8
Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in whi…
quant-ph2025
Experimentally Informed Decoding of Stabilizer Codes Based on Syndrome Correlations
Ants Remm, Nathan Lacroix, Lukas Bödeker +9
High-fidelity decoding of quantum error correction codes relies on an accurate experimental model of the physical errors occurring in the device. Because error probabilities can de…