2 papers
eess.SY2025
Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging
Partho Bhoumik, Christopher Bailey, Krishnendu Chakrabarty
Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. H…
cs.ET2024
The Unlikely Hero: Nonideality in Analog Photonic Neural Networks as Built-in Defender Against Adversarial Attacks
Haotian Lu, Ziang Yin, Partho Bhoumik +3
Electronic-photonic computing systems have emerged as a promising platform for accelerating deep neural network (DNN) workloads. Major efforts have been focused on countering hardw…