C. Adelmann

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cond-mat.mtrl-sci2025

Exploring binary intermetallics for advanced interconnect applications using ab initio simulations

Kiroubanand Sankaran, Kristof Moors, Jean-Philippe SouliÃ© +2

The challenge of increasing copper (Cu) resistivity with diminishing Cu interconnect dimensions in complementary metal-oxide-semiconductor (CMOS) transistors, along with the impera…

cond-mat.mtrl-sci2024

Cu $_{x}$ Al $_{1 - x}$ films as Alternatives to Copper for Advanced Interconnect Metallization

Cu $_{x}$ Al $_{1 - x}$ thin films with $0.2 \leq x \leq 0.7$ have been studied as potential alternatives for the metallization of advanced interconnects. First-principles simulations were…

Exploring binary intermetallics for advanced interconnect applications using ab initio simulations

Cux​Al1−x​ films as Alternatives to Copper for Advanced Interconnect Metallization

Cu $_{x}$ Al $_{1 - x}$ films as Alternatives to Copper for Advanced Interconnect Metallization