2 papers
cond-mat.mtrl-sci2025
Exploring binary intermetallics for advanced interconnect applications using ab initio simulations
Kiroubanand Sankaran, Kristof Moors, Jean-Philippe Soulié +2
The challenge of increasing copper (Cu) resistivity with diminishing Cu interconnect dimensions in complementary metal-oxide-semiconductor (CMOS) transistors, along with the impera…
physics.app-ph2024
Selecting Alternative Metals for Advanced Interconnects
Jean-Philippe Soulié, Kiroubanand Sankaran, Benoit Van Troeye +14
Interconnect resistance and reliability have emerged as critical factors limiting the performance of advanced CMOS circuits. With the slowdown of transistor scaling, interconnect s…