2 papers
physics.app-ph2025
Models for Spatially Resolved Conductivity of Rectangular Interconnects with Integrated Effect of Surface And Grain Boundary Scattering
Xinkang Chen, Sumeet Kumar Gupta
Surface scattering and grain boundary scattering are two prominent mechanisms dictating the conductivity of interconnects and are traditionally modeled using the Fuchs-Sondheimer (…
physics.app-ph2024
The Impact of TaS-Augmented Interconnects on Circuit Performance: A Temperature-Dependent Analysis
Xinkang Chen, Sumeet Kumar Gupta
Monolayer TaS is being explored as a future liner/barrier to circumvent the scalability issues of the state-of-the-art interconnects. However, its large vertical resistivity…