7 citations · 12 across the 5 of their papers we have counts for
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physics.app-ph2021★ 1 cited
A Novel Strategy for GaN-on-Diamond Device with a High Thermal Boundary Conductance
Fengwen Mu, Bin Xu, Xinhua Wang +11
To achieve high device performance and high reliability for the gallium nitride (GaN)-based high electron mobility transistors (HEMTs), efficient heat dissipation is important but…
cond-mat.mtrl-sci2021
Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance
Zhe Cheng, Fengwen Mu, Xiaoyang Ji +6
Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding i…