7 citations · 13 across the 7 of their papers we have counts for
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cond-mat.mtrl-sci2024
Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface
Rulei Guo, Bin Xu, Fengwen Mu +1
SiC is a promising substrate for Si-on-insulator (SOI) wafers for efficient thermal management owing to its high thermal conductivity and large bandgap. However, fabricating a Si d…
cond-mat.mtrl-sci2024★ 1 cited
Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer
Bin Xu, Fengwen Mu, Yingzhou Liu +3
Thermal boundary resistance (TBR) in semiconductor-on-diamond structure bottlenecks efficient heat dissipation in electronic devices. In this study, to reduce the TBR between GaN a…
cond-mat.mtrl-sci2021
Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance
Zhe Cheng, Fengwen Mu, Xiaoyang Ji +6
Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding i…