activity
20192026
most citedMemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration

9 citations · 9 across the 8 of their papers we have counts for

collaborators

8 papers

cs.AR2026

Enabling Mixed criticality applications for the Versal AI-Engines

Vincent Sprave, Martin Wilhelm, Daniele Passaretti +2

Adaptive Systems-on-Chips (SoCs) are increasingly being used in mixed criticality systems (MCSs), such as in autonomous driving, aviation and medical systems. In this context, AMD…

cs.AR2026

Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability

George Rafael Gourdoumanis, Fotoini Oikonomou, Maria Pantazi-Kypraiou +10

As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), th…

cs.LG2025

Rescaling-Aware Training for Efficient Deployment of Deep Learning Models on Full-Integer Hardware

Lion Mueller, Alberto Garcia-Ortiz, Ardalan Najafi +2

Integer AI inference significantly reduces computational complexity in embedded systems. Quantization-aware training (QAT) helps mitigate accuracy degradation associated with post-…

cs.AR2025

VUSA: Virtually Upscaled Systolic Array Architecture to Exploit Unstructured Sparsity in AI Acceleration

Shereef Helal, Alberto Garcia-Ortiz, Lennart Bamberg

Leveraging high degrees of unstructured sparsity is a promising approach to enhance the efficiency of deep neural network DNN accelerators - particularly important for emerging Edg…

cs.LG2023

Exploiting Neural-Network Statistics for Low-Power DNN Inference

Lennart Bamberg, Ardalan Najafi, Alberto Garcia-Ortiz

Specialized compute blocks have been developed for efficient DNN execution. However, due to the vast amount of data and parameter movements, the interconnects and on-chip memories…

cs.AR2021★ 9 cited

MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration

Matheus Cavalcante, Anthony Agnesina, Samuel Riedel +6

Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length t…

cs.AR2019

NoCs in Heterogeneous 3D SoCs: Co-Design of Routing Strategies and Microarchitectures

Jan Moritz Joseph, Lennart Bamberg, Dominik Ermel +4

Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication n…

eess.SP2019

Area Optimization with Non-linear Models in Core Mapping for System-on-Chips

Jan Moritz Joseph, Dominik Ermel, Tobias Drewes +3

Linear models are regularly used for mapping cores to tiles in a chip. System-on-Chip (SoC) design requires integration of functional units with varying sizes, but conventional mod…