3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures

T. Mayer, H. Bender, S. J. K. Lang +16

In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and con…