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20192024
most citedUnderstanding the role of threading dislocations on 4H-SiC MOSFET breakdown under high temperature reverse bias stress

37 citations · 168 across the 12 of their papers we have counts for

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physics.app-ph2024

Time Dependent Dielectric Breakdown in 4H-SiC power MOSFETs under positive and negative gate-bias and gate-current stresses at 200°C

P. Fiorenza, F. Cordiano, S. M. Alessandrino +6

The gate oxide lifetime in 4H-SiC power MOSFETs is typically assessed at fixed and constant gate bias stress, monitoring the time-dependent dielectric breakdown (TDDB).

physics.app-ph2024

Complementary two dimensional carrier profiles of 4H-SiC MOSFETs by Scanning Spreading Resistance Microscopy and Scanning Capacitance Microscopy

Patrick Fiorenza, Marco Zignale, Edoardo. Zanetti +6

This paper reports the results presented in an invited poster during the International Conference on Silicon Carbide and Related Materials (ICSCRM) 2023 held in Sorrento, Italy. Th…

physics.app-ph2020

Nanoscale insights on the origin of the Power MOSFETs breakdown after extremely long high temperature reverse bias stress

P. Fiorenza, M. Alessandrino, B. Carbone +8

In this work, the origin of the dielectric breakdown of 4H-SiC power MOSFETs was studied at the nanoscale, analyzing devices that failed after extremely long (three months) of high…

physics.app-ph202037 cited

Understanding the role of threading dislocations on 4H-SiC MOSFET breakdown under high temperature reverse bias stress

P. Fiorenza, M. Alessandrino, B. Carbone +7

The origin of dielectric breakdown was studied on 4H-SiC MOSFETs that failed after three months of high temperature reverse bias (HTRB) stress. A local inspection of the failed dev…

physics.app-ph202010 cited

On the origin of the premature breakdown of thermal oxide on 3C-SiC probed by electrical scanning probe microscopy

P. Fiorenza, E. Schilirò, F. Giannazzo +4

The dielectric breakdown (BD) of thermal oxide (SiO2) grown on cubic silicon carbide (3C-SiC) was investigated comparing the electrical behavior of macroscopic metal-oxidesemicondu…

physics.app-ph202034 cited

Identification of two trapping mechanisms responsible of the threshold voltage variation in SiO/4H-SiC MOSFETs

Patrick Fiorenza, Filippo Giannazzo, Mario Saggio +1

A non-relaxing method based on cyclic gate bias stress is used to probe the interface or near-interface traps in the SiO/4H-SiC system over the whole 4H-SiC band gap. The tempe…