54 citations · 86 across the 2 of their papers we have counts for
3 papers
Thermal stress modelling of diamond on GaN/III-Nitride membranes
Jerome A. Cuenca, Matthew D. Smith, Daniel E. Field +8
Diamond heat-spreaders for gallium nitride (GaN) devices currently depend upon a robust wafer bonding process. Bonding-free membrane methods demonstrate potential, however, chemica…
Thick adherent diamond films on AlN with low thermal barrier resistance
Soumen Mandal, Jerome Cuenca, Fabien Massabuau +9
Growth of 100 m thick diamond layer adherent on aluminium nitride is presented in this work. While thick films failed to adhere on untreated AlN films, hydrogen/nitrogen plas…
Quantifying Temperature-dependent Substrate Loss in GaN-on-Si RF Technology
Hareesh Chandrasekar, Michael J. Uren, Michael A. Casbon +6
Intrinsic limits to temperature-dependent substrate loss for GaN-on-Si technology, due to the change in resistivity of the substrate with temperature, are evaluated using an experi…