3 papers
cond-mat.mtrl-sci2026
Subgrain-resolved Analysis of Degradation in Cu Metallization via Scanning 3DXRD and Thermomechanical Modeling
Nikhil Prabhu, Laura Neumann, Michael Reisinger +7
Metallization layers play a key role in the performance and reliability of modern power semiconductor devices. During short-circuit events, rapid heating of power metallization lay…
cond-mat.mtrl-sci2025
Deformation mechanisms of L-PBF-processed Ti-6Al-4V investigated using a combined experimental and simulation approach
Pushkar Prakash Dhekne, Nikhil Prabhu, Matthias Bönisch +3
Despite the significant application potential of laser powder bed fusion (L-PBF) processed Ti-6Al-4V components, a detailed understanding of their deformation mechanisms remains li…
cond-mat.mtrl-sci2025
Incorporation of physics-based strengthening coefficients into phenomenological crystal plasticity models
Nikhil Prabhu, Martin Diehl
The efforts associated with parametrization of continuum-based models for crystal plasticity are a significant obstacle for the routine use of these models in materials science and…