47 citations · 87 across the 8 of their papers we have counts for
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cond-mat.mtrl-sci2024
Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface
Rulei Guo, Bin Xu, Fengwen Mu +1
SiC is a promising substrate for Si-on-insulator (SOI) wafers for efficient thermal management owing to its high thermal conductivity and large bandgap. However, fabricating a Si d…
cond-mat.mtrl-sci2024★ 1 cited
Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer
Bin Xu, Fengwen Mu, Yingzhou Liu +3
Thermal boundary resistance (TBR) in semiconductor-on-diamond structure bottlenecks efficient heat dissipation in electronic devices. In this study, to reduce the TBR between GaN a…
cond-mat.mtrl-sci2024★ 5 cited
Non-equilibrium Magnon Engineering Enabling Significant Thermal Transport Modulation
Takamasa Hirai, Toshiaki Morita, Subrata Biswas +13
Thermal conductivity, a fundamental parameter characterizing thermal transport in solids, is typically determined by electron and phonon transport. Although other transport propert…