activity
20172020
most citedCrosstalk Noise based Configurable Computing: A New Paradigm for Digital Electronics

1 citations · 1 across the 3 of their papers we have counts for

collaborators

6 papers

cs.ET20201 cited

Crosstalk Noise based Configurable Computing: A New Paradigm for Digital Electronics

Naveen Kumar Macha, Md Arif Iqbal, Bhavana Tejaswini Repalle +2

The past few decades have seen exponential growth in capabilities of digital electronics primarily due to the ability to scale Integrated Circuits (ICs) to smaller dimensions while…

cs.ET2019

A Logic Simplification Approach for Very Large Scale Crosstalk Circuit Designs

Md Arif Iqbal, Naveen Kumar Macha, Bhavana Tejaswini Repalle +1

Crosstalk computing, involving engineered interference between nanoscale metal lines, offers a fresh perspective to scaling through co-existence with CMOS. Through capacitive manip…

cs.AR2018

A New Paradigm for Fault-Tolerant Computing with Interconnect Crosstalks

Naveen Kumar Macha, Bhavana Tejaswini Repalle, Sandeep Geedipally +2

The CMOS integrated chips at advanced technology nodes are becoming more vulnerable to various sources of faults like manufacturing imprecisions, variations, aging, etc. Additional…

cs.AR2018

Crosstalk based Fine-Grained Reconfiguration Techniques for Polymorphic Circuits

Naveen Kumar Macha, Sandeep Geedipally, Bhavana Repalle +3

Truly polymorphic circuits, whose functionality/circuit behavior can be altered using a control variable, can provide tremendous benefits in multi-functional system design and reso…

cs.ET2018

Thermal Management in Fine-Grained 3-D Integrated Circuits

Md Arif Iqbal, Naveen Kumar Macha, Wafi Danesh +2

For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. Ho…

cs.ET2017

Cost Modeling and Projection for Stacked Nanowire Fabric

Naveen Kumar Macha, Mostafizur Rahman

To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, de…