Fabrication of Ag/Tl-Ba-Ca-CuO/CdSe nanostructure by electrodeposition technique
arXiv:cond-mat/0305397 · doi:10.1016/S0169-4332(01)00459-7
Abstract
Junction between metal, superconductor and semiconductor materials seems to be promising for their applications as the electronic devices, microelectronic devices and high power transmission. E-mail [email protected].
4 pages