Enhancing Conformality in Atomic Layer Deposition through Low Growth Per Cycle

Abstract

Atomic layer deposition (ALD) is a key enabling technology for advanced microelectronics as it enables the growth of functional thin films on complex three-dimensional substrates with unmatched atomic-scale precision. Conformal film growth in high-aspect-ratio (HAR) structures is limited by slow diffusion of reactant molecules into deep, narrow features. This work elucidates an approach to grow conformal films faster by investigating the relationship between the ALD growth per cycle (GPC) and the film penetration depth in HAR structures through modeling and experiments. Diffusion-reaction simulations reveal, under Knudsen diffusion conditions, an inverse square root relationship between the film penetration depth and GPC. The prediction is validated experimentally with a model zinc oxide ALD process on rectangular lateral HAR structures, using an inhibitor molecule to decrease the GPC. While ALD is traditionally optimized for "high GPC," this work shows that "low GPC" may increase efficiency when conformality is key.