On-chip omnidirectional electromagnetic-thermal cloak
arXiv:2401.00856 · doi:10.1016/j.isci.2024.110105
Abstract
Simultaneously guiding electromagnetic waves and heat flow at any incidence angle to smoothly bypass some electromagnetic/thermal sensitive elements is a key factor to ensure efficient communication and thermal protection for an on-chip system. In this study, an omnidirectional on-chip electromagnetic-thermal cloak is proposed. Firstly, a holey metallic plate with periodic array of subwavelength apertures is designed by optical surface transformation to realize an omnidirectional electromagnetic cloaking module for on-chip electromagnetic signal. Secondly, a two-layer ring-shaped engineered thermal structure is designed by solving Laplace equation to realize an omnidirectional thermal cloaking module for in-chip heat flow. Finally, these two cloaking modules are combined elaborately to achieve cloaking effect for both the electromagnetic waves and thermal fields simultaneously from any detecting direction, thus protecting the build-in electromagnetic/thermal sensitive elements without disturbing the external electromagnetic/thermal signal. The proposed electromagnetic-thermal cloak may have potential advantage in dealing with omnidirectional electromagnetic compatibility/shielding and multi-directional thermal management/dissipation of an on-chip system.
References in corpus (10)
- Design of Electromagnetic Cloaks and Concentrators Using Form-Invariant Coordinate Transformations of Maxwell's Equations
- Experimental demonstration of a multiphysics cloak: manipulating heat flux and electric current simultaneously
- Nanowire metamaterials with extreme optical anisotropy
- Superscatterer: Enhancement of scattering with complementary media
- Controlling mass and energy diffusion with metamaterials
- Transformation optics with Fabry-Pérot resonances
- Tunable liquid-solid hybrid thermal metamaterials with a topology transition
- Long-Distance Transfer and Routing of Static Magnetic Fields
- Simultaneously realizing thermal and electromagnetic cloaking by multi-physical null medium
- Active thermal metasurfaces for remote heating/cooling by mimicking negative thermal conductivity