An atomistic model for the thermal resistance of a liquid-solid interface
arXiv:2112.04376 · doi:10.1017/jfm.2021.1136
Abstract
The thermal resistance associated with the interface between a solid and a liquid is analyzed from an atomistic point of view. Partial evaluation of the associated Green-Kubo integral elucidates the various factors governing heat transport across the interface and leads to a quantitative model for the thermal resistance in terms of atomistic-level system parameters. The model is validated using molecular dynamics simulations.