Cooling by Thermodynamic Induction

Abstract

A method is described for cooling conductive channels to below ambient temperature. The thermodynamic induction principle dictates that the electrically biased channel will cool if the electrical conductance decreases with temperature. The extent of this cooling is calculated in detail for both case of ballistic and conventional transport with specific calculations for carbon nanotubes and conventional metals, followed by discussions for semiconductors, graphene, and metal-insulator transition systems. A theorem is established for ballistic transport stating that net cooling is not possible. For conventional transport net cooling is possible over a broad temperature range, with the range being size-dependent. A temperature clamping scheme for establishing a metastable nonequilibrium stationary state is detailed and followed with discussion of possible applications to on-chip thermoelectric cooling in integrated circuitry and quantum computer systems.

References in corpus (6)

• Ultrahigh electron mobility in suspended graphene
• Exact Quantization of Even-Denominator Fractional Quantum Hall State at $\nu$=5/2 Landau Level Filling Factor
• Positive and negative Coulomb drag in vertically integrated one-dimensional quantum wires
• Kondo Temperature in Multilevel Quantum Dots
• Thermodynamic Induction Effects Exhibited in Nonequilibrium Systems with Variable Kinetic Coefficients
• Thermodynamically Induced Particle Transport: Order-by-Induction and Entropic Trapping at the Nano-Scale

Cited by in corpus (1)

• Nonequilibrium Phase Transitions and Pattern Formation as Consequences of Second Order Thermodynamic Induction