Broadband lightweight flat lenses for longwave-infrared imaging
arXiv:1904.09011 · doi:10.1073/pnas.1908447116
Abstract
We experimentally demonstrate imaging in the longwave-infrared (LWIR) spectral band (8um to 12um) using a single polymer flat lens based upon multi-level diffractive optics. The device thickness is only 10μm, and chromatic aberrations are corrected over the entire LWIR band with one surface. Due to the drastic reduction in device thickness, we are able to utilize polymers with absorption in the LWIR, allowing for inexpensive manufacturing via imprint lithography. The weight of our lens is less than 100 times those of comparable refractive lenses. We fabricated and characterized two different flat lenses. Even with about 25% absorption losses, experiments show that our flat polymer lenses obtain good imaging with field of view of ~35degrees and angular resolution less than 0.013 degrees. The flat lenses were characterized with two different commercial LWIR image sensors. Finally, we show that by using lossless, higher-refractive-index materials like silicon, focusing efficiencies in excess of 70% can be achieved over the entire LWIR band. Our results firmly establish the potential for lightweight, ultra-thin, broadband lenses for high-quality imaging in the LWIR band.
References in corpus (5)
- Dielectric Metasurfaces for Complete Control of Phase and Polarization with Subwavelength Spatial Resolution and High Transmission
- Unmanned Aerial Vehicles: A Survey on Civil Applications and Key Research Challenges
- Outlook for inverse design in nanophotonics
- Subwavelength-thick Lenses with High Numerical Apertures and Large Efficiency Based on High Contrast Transmitarrays
- Adjoint method and inverse design for nonlinear nanophotonic devices
Cited by in corpus (4)
- MetaNet: A new paradigm for data sharing in photonics research
- Imaging from the Visible to the Longwave Infrared wavelengths via an inverse-designed flat lens
- Multi-plane, Multi-band image projection via Broadband Diffractive Optics
- Machine Learning enables Design of On-chip Integrated Silicon T-junctions with footprint of 1.2 m x 1.2 m