Superconducting Caps for Quantum Integrated Circuits

Abstract

We report on the fabrication and metrology of superconducting caps for qubit circuits. As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum participation ratio, and improves performance of individual resonant elements. Here, we demonstrate that such caps can be reliably fabricated, placed on a circuit chip, and form superconducting connections to the circuit.

4 pages, 6 figures

References in corpus (1)

• Observation of high coherence in Josephson junction qubits measured in a three-dimensional circuit QED architecture

Cited by in corpus (6)

• High coherence superconducting microwave cavities with indium bump bonding
• Coherent microwave photon mediated coupling between a semiconductor and a superconductor qubit
• Fabrication of superconducting through-silicon vias
• Thin film metrology and microwave loss characterization of indium and aluminum/indium superconducting planar resonators
• Improved Parameter Targeting in 3D-Integrated Superconducting Circuits through a Polymer Spacer Process
• Computational modeling of decay and hybridization in superconducting circuits