Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes

Abstract

We generalize the conditions for stable electrodeposition at isotropic solid-solid interfaces using a kinetic model which incorporates the effects of stresses and surface tension at the interface. We develop a stability diagram that shows two regimes of stability: previously known pressure-driven mechanism and a new density-driven stability mechanism that is governed by the relative density of metal in the two phases. We show that inorganic solids and solid polymers generally do not lead to stable electrodeposition, and provide design guidelines for achieving stable electrodeposition.

7 pages, 3 figures, v2: added more explanation, supplemental material, references, corrected typos

References in corpus (3)

• Quantification of uncertainty in first-principles predicted mechanical properties of solids: Application to solid ion conductors
• Stress-driven phase transformation and the roughening of solid-solid interfaces
• The thermodynamics and roughening of solid-solid interfaces

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