Carbon nanotubes as heat dissipaters in microelectronics
arXiv:1309.6918 · doi:10.1140/epjb/e2013-40113-5
Abstract
We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties of nanotubes in presence of an interface with various substances, including air and water. Comparison with previous works is established whenever is possible.
14 pages, 21 figures, 5 tables
References in corpus (4)
- Electron- and phonon transport in silicon nanowires: an atomistic approach to thermoelectric properties
- Scaling theory put into practice: first-principles modeling of transport in doped silicon nanowires
- Electronic transport in Si nanowires: Role of bulk and surface disorder
- Plasmon excitations on a single-wall carbon nanotube by external charges: two-dimensional, two-fluid hydrodynamic model