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Showing 2026 · cond-mat.mtrl-sciShow all
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cond-mat.mtrl-sci2026
Role of surface states and band modulations in ultrathin ruthenium interconnects
Gyungho Maeng, Subeen Lim, Mi Gyoung Lee +3
Mitigating the RC delay from transistor miniaturization is essential for next-generation devices, driving a focus on interconnect electrical performance. Current copper-based inter…
cond-mat.mtrl-sci2026
First-principles high-throughput screening of ruthenium compounds for advanced interconnects
Gyungho Maeng, Subeen Lim, Bonggeun Shong +1
As interconnect dimensions continue to shrink, the industry-standard copper faces a critical increase in resistivity, presenting a significant hurdle to overall device performance.…