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physics.class-ph2008
Contact identification for assembly-disassembly simulation with a haptic device
Robert Iacob, Peter Mitrouchev, Jean-Claude Léon
Assembly/Disassembly (A/D) simulations using haptic devices are facing difficulties while simulating insertion/extraction operations such as removing cylinders from holes. In order…
physics.class-ph2007★ 1 cited
Product ecodesign and materials: current status and future prospects
Fabrice Mathieux, Daniel Brissaud, Peggy Zwolinski
The aim of this paper is to discuss the current status of ecodesign in the industry and its future implications for materials. There is today more and more focus on the environment…