researchers with a paper here

1 paper

cs.OH2008

Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging

A. A. Hamzah, Y. Husaini, B. Y. Majlis +1

Deflection behavior of several encapsulant materials under uniform pressure was studied to determine the best encapsulant for MEMS device. Encapsulation is needed to protect movabl…