623 citations
Counting papers with at most 25 authors, so collaboration author lists do not stand in for the people here.
- Huazhong University of Science and TechnologyCN43 papers
- Nanjing Normal UniversityCN6 papers
- Hong Kong University of Science and TechnologyHK3 papers
- Imperial College LondonGB3 papers
- Shaanxi University of Science and TechnologyCN3 papers
- Beijing Computational Science Research CenterCN2 papers
- Hangzhou Dianzi UniversityCN2 papers
- Kafrelsheikh UniversityEG2 papers
- Massachusetts Institute of TechnologyUS2 papers
- National Institute for Materials ScienceJP2 papers
- National University of SingaporeSG2 papers
- Southern University of Science and TechnologyCN2 papers
3 papers · 2 filters
A Modified Theoretical Model to Predict the Thermal Interface Conductance Considering Interface Roughness
Yingying Zhang, Dengke Ma, Yi Zang +1
The acoustic mismatch model and the diffuse mismatch model have been widely used to predict the thermal interface conductance. However, the acoustic mismatch model (diffuse mismatc…
Enhancement of interfacial thermal conductance of SiC by overlapped carbon nanotubes and intertube atoms
Chengcheng Deng, Xiaoxiang Yu, Xiaoming Huang +1
We proposed a new way, adding intertube atoms, to enhance interfacial thermal conductance (ITC) between SiC-carbon nanotube (CNT) array structure. Non-equilibrium molecular dynamic…
The adjustable thermal resistor by reversibly folding a graphene sheet
Qichen Song, Meng An, Xiandong Chen +3
Phononic (thermal) devices are studied such as thermal diode, thermal transistors, thermal logic gates, and thermal memories. However, the thermal resistor has not been demonstrate…