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1 paper

cs.AR2026

Toward Mitigating Process-Induced Performance Degradation in 3.5D Heterogeneous Packages via Pre-Silicon Firmware Co-Optimization

Chi Fei Chung

This paper presents a pre-silicon analysis of XRM-SSD V24/V7.0, a physics-aware predictive firmware scheduling layer for Intel's 3.5D heterogeneous integrated packages (Foveros Dir…