papers

Publications (13)

cs.CV2026

MetaEarth3D: Unlocking World-scale 3D Generation with Spatially Scalable Generative Modeling

Jinqi Cao, Zhiping Yu, Baihong Lin +3

Recent generative AI models have achieved remarkable breakthroughs in language and visual understanding. However, although these models can generate realistic visual content, their…

cs.AR2025

Automated SAR ADC Sizing Using Analytical Equations

Zhongyi Li, Zhuofu Tao, Yanze Zhou +4

Conventional analog and mixed-signal (AMS) circuit designs heavily rely on manual effort, which is time-consuming and labor-intensive. This paper presents a fully automated design…

cs.CV2024

MetaEarth: A Generative Foundation Model for Global-Scale Remote Sensing Image Generation

Zhiping Yu, Chenyang Liu, Liqin Liu +2

The recent advancement of generative foundational models has ushered in a new era of image generation in the realm of natural images, revolutionizing art design, entertainment, env…

cs.CV2025

AMSnet 2.0: A Large AMS Database with AI Segmentation for Net Detection

Yichen Shi, Zhuofu Tao, Yuhao Gao +5

Current multimodal large language models (MLLMs) struggle to understand circuit schematics due to their limited recognition capabilities. This could be attributed to the lack of hi…

cs.CE2026

Therm-FM: Foundation Model is ALL YOU NEED for 3D-ICs Thermal Simulation

Zhen Huang, Haiyang Xin, Wenkai Yang +6

Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation c…

cs.LG2025

AMSbench: A Comprehensive Benchmark for Evaluating MLLM Capabilities in AMS Circuits

Yichen Shi, Ze Zhang, Hongyang Wang +10

Analog/Mixed-Signal (AMS) circuits play a critical role in the integrated circuit (IC) industry. However, automating Analog/Mixed-Signal (AMS) circuit design has remained a longsta…

cs.LG2024

RLPlanner: Reinforcement Learning based Floorplanning for Chiplets with Fast Thermal Analysis

Yuanyuan Duan, Xingchen Liu, Zhiping Yu +3

Chiplet-based systems have gained significant attention in recent years due to their low cost and competitive performance. As the complexity and compactness of a chiplet-based syst…

cs.AI2024

AMSnet-KG: A Netlist Dataset for LLM-based AMS Circuit Auto-Design Using Knowledge Graph RAG

Yichen Shi, Zhuofu Tao, Yuhao Gao +9

High-performance analog and mixed-signal (AMS) circuits are mainly full-custom designed, which is time-consuming and labor-intensive. A significant portion of the effort is experie…

cond-mat.mes-hall2014

Compact Model of Nanowire Tunneling FETs Including Phonon-Assisted Tunneling and Quantum Capacitance

Qiming Shao, Can Zhao, Jinyu Zhang +2

A physics-based compact model for silicon gate-all-around (GAA) nanowire tunneling FETs (NW-tFETs) with good accuracy has been developed by considering Phonon-Assisted Tunneling (P…

cs.AR2026

AMSnet-q: Unsupervised Circuit Identification and Performance Labeling for AMS Circuits

Ze Zhang, Junzhuo Zhou, Yichen Shi +6

Analog and mixed-signal (AMS) circuit design remains heavily reliant on expert knowledge. While recent AI-driven automation tools can generate candidate topologies, they critically…

cs.CV2024

AMSNet: Netlist Dataset for AMS Circuits

Zhuofu Tao, Yichen Shi, Yiru Huo +8

Today's analog/mixed-signal (AMS) integrated circuit (IC) designs demand substantial manual intervention. The advent of multimodal large language models (MLLMs) has unveiled signif…

cs.CV2026

MetaEarth-MM: Unified Multimodal Remote Sensing Image Generation with Scene-centered Joint Modeling

Zhiping Yu, Chenyang Liu, Jinqi Cao +4

Multi-modal remote sensing images are vital for Earth observation, yet complete paired observations are often scarce in practice. Existing generative methods commonly address this…

eess.SP2025

Hierarchical Decoupling Capacitor Optimization for Power Distribution Network of 2.5D ICs with Co-Analysis of Frequency and Time Domains Based on Deep Reinforcement Learning

Yuanyuan Duan, Haiyang Feng, Zhiping Yu +3

With the growing need for higher memory bandwidth and computation density, 2.5D design, which involves integrating multiple chiplets onto an interposer, emerges as a promising solu…