Publications (4)
Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology
Bingyang Guo, Qiang Zuo, Ruiyun Yu
The effective segmentation of 3D data is crucial for a wide range of industrial applications, especially for detecting subtle defects in the field of integrated circuits (IC). Cera…
CD: Fine-grained 3D Mesh Reconstruction With Twice Chamfer Distance
Rongfei Zeng, Mai Su, Ruiyun Yu +1
Monocular 3D reconstruction is to reconstruct the shape of object and its other information from a single RGB image. In 3D reconstruction, polygon mesh, with detailed surface infor…
IEC3D-AD: A 3D Dataset of Industrial Equipment Components for Unsupervised Point Cloud Anomaly Detection
Bingyang Guo, Hongjie Li, Ruiyun Yu +2
3D anomaly detection (3D-AD) plays a critical role in industrial manufacturing, particularly in ensuring the reliability and safety of core equipment components. Although existing…
Open-Set Supervised 3D Anomaly Detection: An Industrial Dataset and a Generalisable Framework for Unknown Defects
Hanzhe Liang, Luocheng Zhang, Junyang Xia +7
Although self-supervised 3D anomaly detection assumes that acquiring high-precision point clouds is computationally expensive, in real manufacturing scenarios it is often feasible…